Systems and methods for recycling electronic systems

ABSTRACT

In accordance with certain embodiments, devices are recycled by removing one or more electronic components from a portion of the device and urging one or more regions of the portion of the device toward an abrasion head. The abrasion head mechanically removes at least a portion of patternable material in each of the one or more regions. The steps are repeated for subsequent portions of the device.

RELATED APPLICATIONS

This application claims the benefit of and priority to U.S. ProvisionalPatent Application No. 62/106,911, filed Jan. 23, 2015, the entiredisclosure of which is hereby incorporated herein by reference.

FIELD OF THE INVENTION

In various embodiments, the present invention relates generally torecycling of electronic systems, and more specifically to recyclingsystems featuring patterned multi-layer composite structures.

BACKGROUND

A variety of methods are used for patterning composite sheet ormulti-layer materials, for example ink-on-paper, metal-on-plastic, ormore generally, one or more materials to be patterned on a substratematerial. Conventional patterning methods include subtractive processesthat start with the composite structure and remove one or more portionsof undesired material from a substrate, such as patterning and etching,laser etching or cutting, mechanical abrasion or the like, and additiveprocesses that add the desired material to a substrate, such as printing(for example ink jet, gravure, flexographic, or other types ofprinting), plating, vapor phase deposition, and the like.

Many of these methods are not amenable to cost-effective fastturn-around processing because of the time and cost associated with thepatterning process. For example, roll-to-roll processing using a gravureroller to form a resist on a composite structure and then etching offthe desirable material and cleaning the final product is an efficientway to make very large quantities of a single design, using a singlematerial. Such roll-to-roll processes can be cost-effective despite therelatively long time, high complexity, and high cost associated withmaking the gravure roller and starting up the process, since such costscan be amortized over the very large volumes. At the other end of theprocess spectrum, digital printers, for example ink jet or wax or otherprinters, can relatively very quickly adapt to new patterns, but thesetechniques are relatively slow to produce large patterned areas, thusincreasing the cost significantly beyond that of relatively morehigh-volume processes. In addition, such digital printers typically donot have sufficient throughput to match the capacity of subsequentprocesses that rely on their output, e.g., the manufacture of flexibleprinted circuit boards. Finally, additive processes, particularly foraddition of electrically conductive materials (e.g., for printed circuitboards), typically have significantly lower conductivity than bulkconductive materials, for two reasons. The first is that theconductivity of the printed materials, for example printable conductiveinks, is not typically as high as the bulk metal. For example, theprinted materials may typically have about 3 times to about 6 timeslower conductivity. The second is that these printed materials oftencannot be printed at the same thickness as the bulk material. Forexample, they may have a thickness about 5 times to about 50 timesthinner than available bulk materials.

Finally, many of these conventional processes use relatively largeamounts of energy as well as relatively hazardous and/or toxic chemicalsand may produce significant waste. For example, systems for patterningcopper or metal layers on a substrate require large chemical etch bathsthat may have high operational, maintenance and disposal costsassociated with large amounts of potentially non-environmentallyfriendly chemicals and other waste.

Accordingly, there is a need for solutions that provide for low-cost,environmentally friendly, high-throughput, easily changeable patterningof layered structures of any length, particularly for roll-to-rollprocessing. Such solutions would also desirably be utilizable forrecycling of such layered structures.

SUMMARY

In accordance with various embodiments of the present invention,patterns are formed via mechanical abrasion of a composite material thatincludes a patternable material disposed over a substrate. Specifically,programmable and controllable actuators are utilized to urge variousportions of the composite material toward one or more abrasion stationswhere the patternable material is removed. Movement of the compositematerial and corresponding control of the actuators results in theformation of a desired two-dimensional pattern on the compositematerial. Embodiments of the invention therefore enable the very rapidformation of desired, user-defined patterns that need not be repetitiveor confined to particular pattern dimensions or feature sizes. Inaddition, embodiments of the invention need not utilize chemical removalof the patternable material, saving materials costs in anenvironmentally friendly manner.

Exemplary patterning systems in accordance with embodiments of thepresent invention include or consist essentially of one or more abrasionstations positioned over a patterning head, and the composite materialto be patterned passes between the abrasion station and the patterninghead. The material to be patterned is removed by the abrasion stationwhen the composite material is locally moved toward the abrasion stationby the patterning head.

Patterning systems and techniques in accordance with embodiments of thepresent invention may also be utilized and adapted for the recycling ofelectronic structures, e.g., electronic systems incorporating patternedlayered composite materials and electronic components (e.g.,light-emitting elements) disposed thereover. In various embodiments, therecycling of such systems may include removal of the electroniccomponents and the removal of the patterned patternable material,leaving the bare substrate from the composite material that may beseparately recycled or reutilized. The patternable material may beremoved from the composite material by urging the composite materialtoward one or more abrasion stations. The various steps in recyclingprocesses in accordance with embodiments of the invention may beperformed as parts of a roll-to-roll process.

As utilized herein, the term “light-emitting element” (LEE) refers toany device that emits electromagnetic radiation within a wavelengthregime of interest, for example, visible, infrared or ultravioletregime, when activated, by applying a potential difference across thedevice or passing a current through the device. Examples oflight-emitting elements include solid-state, organic, polymer,phosphor-coated or high-flux LEDs, laser diodes or other similar devicesas would be readily understood. The emitted radiation of an LEE may bevisible, such as red, blue or green, or invisible, such as infrared orultraviolet. An LEE may produce radiation of a continuous ordiscontinuous spread of wavelengths. An LEE may feature a phosphorescentor fluorescent material, also known as a light-conversion material, forconverting a portion of its emissions from one set of wavelengths toanother. In some embodiments, the light from an LEE includes or consistsessentially of a combination of light directly emitted by the LEE andlight emitted by an adjacent or surrounding light-conversion material.An LEE may include multiple LEEs, each emitting essentially the same ordifferent wavelengths. In some embodiments, a LEE is an LED that mayfeature a reflector over all or a portion of its surface upon whichelectrical contacts are positioned. The reflector may also be formedover all or a portion of the contacts themselves. In some embodiments,the contacts are themselves reflective. Herein the term “reflective” isdefined as having a reflectivity greater than 65% for a wavelength oflight emitted by the LEE on which the contacts are disposed unlessotherwise defined. In some embodiments, an LEE may include or consistessentially of an electronic device or circuit or a passive device orcircuit. In some embodiments, an LEE includes or consists essentially ofmultiple devices, for example an LED and a Zener diode forstatic-electricity protection. In some embodiments, an LEE may includeor consist essentially of a packaged LED, i.e., a bare LED die encasedor partially encased in a package. In some embodiments, the packaged LEDmay also include a light-conversion material. In some embodiments, thelight from the LEE may include or consist essentially of light emittedonly by the light-conversion material, while in other embodiments thelight from the LEE may include or consist essentially of a combinationof light emitted from an LED and from the light-conversion material. Insome embodiments, the light from the LEE may include or consistessentially of light emitted only by an LED.

In one embodiment, an LEE includes or consists essentially of a baresemiconductor die, while in other embodiments an LEE includes orconsists essentially of a packaged LED. In some embodiments, LEE mayinclude or consist essentially of a “white die” that includes an LEDthat is integrated with a light-conversion material (e.g., a phosphor)before being attached to the light sheet, as described in U.S. patentapplication Ser. No. 13/748,864, filed Jan. 24, 2013, or U.S. patentapplication Ser. No. 13/949,543, filed Jul. 24, 2013, the entiredisclosure of each of which is incorporated by reference herein.

In an aspect, embodiments of the invention feature a method of recyclinga device that includes, consists essentially of, or consists of aplurality of electronic components disposed over a composite material.The composite material includes, consists essentially of, or consists ofa substrate and a patternable material disposed thereover. Thepatternable material is patterned to form a pattern therein. A portionof the device is received. One or more electronic components are removedfrom the received portion of the device. One or more regions of thereceived portion of the device are urged toward an abrasion head,whereby the abrasion head mechanically removes at least a portion of thepatternable material in each of the one or more regions. Those steps arerepeated for one or more portions of the device.

Embodiments of the invention may include one or more of the following inany of a variety of combinations. Removing the one or more electroniccomponents from the received portion of the device may include, consistessentially of, or consist of mechanical scraping. The received portionof the device may be urged toward the abrasion head by one or moreactuators (e.g., mechanical actuators, pneumatic actuators, hydraulicactuators, electric actuators, thermal actuators, magnetic actuators,linear actuators, piezoelectric actuators, etc.). The received portionof the device may be disposed between the abrasion head and the one ormore actuators. The one or more actuators may be disposed above or belowthe received portion of the device. The one or more removed electroniccomponents may be stored (e.g., in a bin or other receptacle) afterremoval thereof. The removed at least a portion of the patternablematerial may be stored (e.g., in a bin or other receptacle) afterremoval thereof. The receiving of the portion of the device, the removalof the one or more electronic components, and the urging of the one ormore regions of the received portion of the device toward the abrasionhead may be performed as steps in a roll-to-roll process. For example,the portion of the device may be received from a supply reel, and/or thereceived portion of the device may be transferred to a take-up reelafter removal of the one or more electronic components and the urging ofthe one or more regions of the received portion of the device toward theabrasion head.

In another aspect, embodiments of the invention feature a method ofrecycling a device that includes, consists essentially of, or consistsof a plurality of electronic components disposed over a compositematerial. The composite material includes, consists essentially of, orconsists of a substrate and a patternable material disposed thereover.The patternable material is patterned to form a pattern therein. Aportion of the device is received. One or more electronic components areremoved from the received portion of the device. At least a portion ofthe patternable material is removed from the received portion of thedevice. Those steps are repeated for one or more portions of the device.The receiving of the portion of the device, the removal of the one ormore electronic components, and the removal of the at least a portion ofthe patternable material may be performed as steps in a roll-to-rollprocess. For example, the portion of the device may be received from asupply reel, and/or the received portion of the device may betransferred to a take-up reel after removal of the one or moreelectronic components and the at least a portion of the patternablematerial.

Embodiments of the invention may include one or more of the following inany of a variety of combinations. Removing the one or more electroniccomponents from the received portion of the device may include, consistessentially of, or consist of mechanical scraping. Removing the at leasta portion of the patternable material from the received portion of thedevice may include, consist essentially of, or consist of urging thereceived portion of the device toward an abrasion head, whereby theabrasion head mechanically removes at least a portion of the patternablematerial from the received portion of the device. The received portionof the device may be urged toward the abrasion head by one or moreactuators (e.g., mechanical actuators, pneumatic actuators, hydraulicactuators, electric actuators, thermal actuators, magnetic actuators,linear actuators, piezoelectric actuators, etc.). The received portionof the device may be disposed between the abrasion head and the one ormore actuators. The one or more actuators may be disposed above or belowthe received portion of the device. The one or more removed electroniccomponents may be stored (e.g., in a bin or other receptacle) afterremoval thereof. The removed at least a portion of the patternablematerial may be stored (e.g., in a bin or other receptacle) afterremoval thereof.

In yet another aspect, embodiments of the invention feature a system forrecycling a device that includes, consists essentially of, or consistsof a plurality of electronic components disposed over a compositematerial. The composite material includes, consists essentially of, orconsists of a substrate and a patternable material disposed thereover.The patternable material is patterned to form a pattern therein. Thesystem includes, consists essentially of, or consists of acomponent-removal station, an abrasion station, a patterning head, and amaterial handling system. The component-removal station includes,consists essentially of, or consists of means for removing electroniccomponents from the composite material. The abrasion station includes,consists essentially of, or consists of means for removing patternablematerial from the substrate. The patterning head includes, consistsessentially of, or consists of means for urging portions of thecomposite material toward the abrasion station. The material handlingsystem transfers successive portions of the composite material to thecomponent-removal station, the abrasion station, and the patterninghead.

Embodiments of the invention may include one or more of the following inany of a variety of combinations. The means for removing patternablematerial may include, consist essentially of, or consist of one or moreabrasion heads. The means for removing patternable material may include,consist essentially of, or consist of one or more milling or grindingwheels, one or more ultrasonic milling tools, and/or one or moreablation tools. The means for urging portions of the composite materialtoward the abrasion station may include, consist essentially of, orconsist of one or more actuators (e.g., mechanical actuators, pneumaticactuators, hydraulic actuators, electric actuators, thermal actuators,magnetic actuators, linear actuators, piezoelectric actuators, etc.).The material handling system may include, consist essentially of, orconsist of (i) a supply reel for supplying the composite material tocomponent-removal station, the abrasion station, and the patterninghead, and (ii) a take-up reel for receiving the composite material fromcomponent-removal station, the abrasion station, and the patterninghead. The means for removing electronic components from the compositematerial may include, consist essentially of, or consist of a mechanicalscraper. The system may include a receptacle for receiving removedelectronic components and/or a receptacle for receiving removedpatternable material.

In another aspect, embodiments of the invention feature a method offorming a pattern in a composite material. The composite materialincludes, consists essentially of, or consists of a substrate and apatternable material disposed thereover. In a step (a), a portion of thecomposite material is disposed proximate (e.g., above or beneath) anabrasion head. In a step (b), one or more regions of the portion of thecomposite material are selectively urged toward the abrasion head,whereby the abrasion head mechanically removes at least a portion of thepatternable material in each of the one or more regions. In a step (c),the composite material is translated with respect to the abrasion head,thereby disposing a new portion of the composite material proximate theabrasion head.

The composite material may be moved relative to the abrasion head, theabrasion head may be moved relative to the composite material, or boththe composite material and the abrasion head may be moved relative toeach other. In a step (d), steps (b) and (c) are repeated one or moretimes to form the pattern.

Embodiments of the invention may include one or more of the following inany of a variety of combinations. The one or more regions of the portionof the composite material may be urged toward the abrasion head by oneor more actuators (e.g., mechanical actuators, pneumatic actuators,hydraulic actuators, electric actuators, thermal actuators, magneticactuators, linear actuators, piezoelectric actuators, etc.). Thecomposite material may be disposed between the abrasion head and the oneor more actuators. The one or more actuators may be disposed above orbeneath the composite material. The composite material may be translatedwith respect to the abrasion head without moving, translating, orrotating the one or more actuators. The one or more regions of theportion of the composite material may be heated prior to and/or duringstep (b). The composite material may be in the form of a web dispensedfrom a supply reel. The composite material may be suspended between thesupply reel and a take-up reel. Portions of the composite material maybe transferred to a take-up reel after portions of the pattern areformed thereon. The substrate may be flexible. The patternable materialmay include, consist essentially of, or consist of one or more metals.In a step (e), an adhesive may be dispensed on one or more sites withinthe pattern. In a step (f), an electronic component may be disposed onthe adhesive at the one or more sites. In a step (g), the adhesive maybe cured, thereby bonding the electronic components to the compositematerial. One or more of the electronic components may include, consistessentially of, or consist of a light-emitting element. Thelight-emitting element may include, consist essentially of, or consistof a light-emitting diode. In a step (h), one or more of thelight-emitting elements may be electro-optically tested (i.e., a currentand/or voltage may be applied to the one or more light-emittingelements, and one or more properties (e.g., intensity, colortemperature, etc.) of the resulting emitted light may be evaluated).Steps (a)-(g) may be performed as parts of a roll-to-roll process. In astep (h), one or more of the electronic components may be electronicallytested. A computational representation of the pattern may be stored(e.g., electronically stored within a computer memory). A set of datacorresponding to a substantially linear portion of the pattern may beextracted from the computational representation and step (b) may beperformed in accordance with the data.

In yet another aspect, embodiments of the invention feature a system forthe formation of a pattern in a composite material. The compositematerial includes, consists essentially of, or consists of a substrateand a patternable material disposed thereover. The system includes,consists essentially of, or consists of an abrasion station, apatterning head, a material handling system, and circuitry. The abrasionstation includes, consists essentially of, or consists of means forremoving patternable material from the substrate. The patterning headincludes, consists essentially of, or consists of means for selectivelyurging portions of the composite material toward the abrasion station.The material handling system transfers successive portions of thecomposite material to the abrasion station and the patterning head. Thecircuitry controls the patterning head and the material handling systemto create a substantially linear portion of the pattern in eachsuccessively transferred portion of the composite material.

Embodiments of the invention may include one or more of the following inany of a variety of combinations. The circuitry may include, consistessentially of, or consist of a computer-based controller forcontrolling the patterning head and the material handling system. Thecontroller may control the abrasion station. The computer-basedcontroller may include, consist essentially of, or consist of a computermemory and a rendering module. The computer memory may store acomputational representation of the pattern. The rendering module mayextract sets of data corresponding to successive substantially linearportions from the computational representation. The controller may causethe patterning head and the material handling system to form successivesubstantially linear portions of the pattern in accordance with thedata. The means for removing patternable material may include, consistessentially of, or consist of one or more abrasion heads. The means forremoving patternable material may include, consist essentially of, orconsist of one or more milling or grinding wheels, one or moreultrasonic milling tools, and/or one or more ablation tools. The meansfor selectively urging portions of the composite material toward theabrasion station may include, consist essentially of, or consist of oneor more actuators (e.g., mechanical actuators, pneumatic actuators,hydraulic actuators, electric actuators, thermal actuators, magneticactuators, linear actuators, piezoelectric actuators, etc.). The one ormore actuators may include, consist essentially of, or consist of aplurality of discrete actuators separated by a spacing therebetween. Thespacing may range from approximately 10 μm to approximately 1 mm. Alateral dimension (e.g., diameter, width, etc.) of each said actuatormay range from approximately 10 μm to approximately 1 mm. The materialhandling system may include, consist essentially of, or consist of asupply reel for supplying the composite material to the abrasion stationand the patterning head and a take-up reel for receiving the compositematerial from the abrasion station and the patterning head. The systemmay include an adhesive dispenser positioned (i) downstream of thepatterning head and (ii) to dispense adhesive over patterned compositematerial. The system may include a component-placement tool positioned(i) downstream of the adhesive dispenser and (ii) to place one or moreelectronic components over the dispensed adhesive. The system mayinclude an adhesive-curing tool positioned (i) downstream of thecomponent-placement tool and (ii) to cure the dispensed adhesive,whereby the one or more electronic components are bonded via curedadhesive to the patterned composite material. The system may include atesting station positioned (i) downstream of the adhesive-curing tooland (ii) to test (e.g., electronically test, opto-electronically test,etc.) at least one said bonded electronic component.

In another aspect, embodiments of the invention feature a method offorming a pattern in a composite material. The composite materialincludes, consists essentially of, or consists of a substrate and apatternable material disposed thereover. In a step (a), a computationalrepresentation of the pattern is electronically stored (e.g., in acomputer memory). In a step (b), a portion of the composite material isdisposed proximate (e.g., above or beneath) an abrasion head. In a step(c), a set of data corresponding to a substantially linear portion ofthe pattern is extracted from the computational representation. In astep (d), in accordance with the extracted set of data, one or moreregions of the portion of the composite material are selectively urgedtoward the abrasion head, whereby the abrasion head mechanically removesat least a portion of the patternable material in each of the one ormore regions. In a step (e), the composite material is translated withrespect to the abrasion head, thereby disposing a new portion of thecomposite material proximate the abrasion head. The composite materialmay be moved relative to the abrasion head, the abrasion head may bemoved relative to the composite material, or both the composite materialand the abrasion head may be moved relative to each other. In a step(f), steps (b)-(e) are repeated one or more times to form the pattern.

Embodiments of the invention may include one or more of the following inany of a variety of combinations. The one or more regions of the portionof the composite material may be urged toward the abrasion head by oneor more actuators (e.g., mechanical actuators, pneumatic actuators,hydraulic actuators, electric actuators, thermal actuators, magneticactuators, linear actuators, piezoelectric actuators, etc.). Thecomposite material may be disposed between the abrasion head and the oneor more actuators. The one or more actuators may be disposed above orbeneath the composite material. The composite material may be translatedwith respect to the abrasion head without moving, translating, orrotating the one or more actuators. The one or more regions of theportion of the composite material may be heated prior to and/or duringstep (d). The composite material may be in the form of a web dispensedfrom a supply reel. The composite material may be suspended between thesupply reel and a take-up reel. Portions of the composite material maybe transferred to a take-up reel after portions of the pattern areformed thereon. The substrate may be flexible. The patternable materialmay include, consist essentially of, or consist of one or more metals.In a step (g), an adhesive may be dispensed on one or more sites withinthe pattern. In a step (h), an electronic component may be disposed onthe adhesive at the one or more sites. In a step (i), the adhesive maybe cured, thereby bonding the electronic components to the compositematerial. One or more of the electronic components may include, consistessentially of, or consist of a light-emitting element. Thelight-emitting element may include, consist essentially of, or consistof a light-emitting diode. In a step (j), one or more of thelight-emitting elements may be electro-optically tested (i.e., a currentand/or voltage may be applied to the one or more light-emittingelements, and one or more properties (e.g., intensity, colortemperature, etc.) of the resulting emitted light may be evaluated).Steps (b)-(i) may be performed as parts of a roll-to-roll process. In astep (j), one or more of the electronic components may be electronicallytested.

These and other objects, along with advantages and features of theinvention, will become more apparent through reference to the followingdescription, the accompanying drawings, and the claims. Furthermore, itis to be understood that the features of the various embodimentsdescribed herein are not mutually exclusive and can exist in variouscombinations and permutations. Reference throughout this specificationto “one example,” “an example,” “one embodiment,” or “an embodiment”means that a particular feature, structure, or characteristic describedin connection with the example is included in at least one example ofthe present technology. Thus, the occurrences of the phrases “in oneexample,” “in an example,” “one embodiment,” or “an embodiment” invarious places throughout this specification are not necessarily allreferring to the same example. Furthermore, the particular features,structures, routines, steps, or characteristics may be combined in anysuitable manner in one or more examples of the technology. As usedherein, the terms “about,” “approximately,” and “substantially” mean±10%, and in some embodiments, ±5%. The term “consists essentially of”means excluding other materials that contribute to function, unlessotherwise defined herein. Nonetheless, such other materials may bepresent, collectively or individually, in trace amounts.

Herein, two components such as light-emitting elements and/or opticalelements being “aligned” or “associated” with each other may refer tosuch components being mechanically and/or optically aligned. By“mechanically aligned” is meant coaxial or situated along a parallelaxis. By “optically aligned” is meant that at least some light (or otherelectromagnetic signal) emitted by or passing through one componentpasses through and/or is emitted by the other. Substrates, light sheets,components, and/or portions thereof described as “reflective” may bespecularly reflective or diffusively reflective unless otherwiseindicated.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, like reference characters generally refer to the sameparts throughout the different views. Also, the drawings are notnecessarily to scale, emphasis instead generally being placed uponillustrating the principles of the invention. In the followingdescription, various embodiments of the present invention are describedwith reference to the following drawings, in which:

FIGS. 1A-1F are cross-sectional schematics of patterning systems inaccordance with various embodiments of the invention;

FIG. 1G is a cross-sectional schematic of a patterned substrate inaccordance with various embodiments of the invention;

FIG. 2 is a cross-sectional schematic of a roll-to-roll patterningsystem in accordance with various embodiments of the invention;

FIG. 3 is a plan-view schematic of patterning actuators in accordancewith various embodiments of the invention;

FIG. 4 is a cross-sectional schematic of a roll-to-roll manufacturingsystem in accordance with various embodiments of the invention;

FIG. 5 is a plan-view schematic of an illumination device fabricated inaccordance with various embodiments of the invention; and

FIG. 6 is a cross-sectional schematic of a roll-to-roll recycling systemin accordance with various embodiments of the invention.

DETAILED DESCRIPTION

FIGS. 1A-1F depict an exemplary patterning system 100, in accordancewith embodiments of the present invention, which features a controller140, an abrasion station 110, a patterning head 120, and a materialhandling system 150. As shown patterning system 100 may be utilized topattern a composite material 130 that includes, consists essentially of,or consists of a substrate 125 and a patternable material (material tobe patterned) 128. Patterning head 120 typically includes multipleactuators 121 along the width of the head (into the page of FIG. 1A),and each actuator 121, when actuated, raises composite material 130 suchthat patternable material 128 is moved into the processing range ofabrasion station 110, resulting in removal of the patternable material128 at that position along the width of abrasion station 110. Abrasionstation 110 includes an abrasion head 111, which is capable of abradingpatternable material 128. The actuators 121 are individually addressableand controllable, and controller 140 energizes each actuator 121 inpatterning head 120 according to a user-defined program or recipe. Thus,a line pattern is formed in patternable material 128 along the width ofpatterning head 120, and, as the composite material 130 feeds throughthe patterning system 100, a desired two-dimensional pattern is formedline-by-line. FIG. 1A shows actuator 121 in a non-energized position,such that patternable material 128 is not being abraded by abrasionstation 110, while FIG. 1B shows actuator 121 in an energized position,such that a portion of patternable material 128 is being removed byabrasion station 110. In various embodiments of the present invention,composite material 130 may be relatively stiff and exhibit partial orsubstantially no deformation around actuator 121, as shown in FIG. 1B;however, this is not a limitation of the present invention, and in otherembodiments composite material 130 may be pliant or deformable anddeform or partially deform around actuator 121 when it is energizedand/or un-energized.

The controller 140 in accordance with embodiments of the invention mayinclude, for example, a computer memory 142 and a rendering module 144.Computational representations of two-dimensional patterns may be storedin the computer memory 142, and the rendering module 144 may extractsets of data corresponding to successive linear portions of a desiredtwo-dimensional pattern from the computational representation. Thecontroller 140 may control the patterning head 120 (including actuators121) and material handling system 150 to form successive linear portionsof stored patterns in accordance with the data. The controller 140 mayalso control abrasion station 110 (including abrasion head 111). Thedesired pattern may be a pattern stored in the computer memory 142 andselected by a user of patterning system 100, or the pattern may bedirectly input by a user into controller 140 via, e.g., one or moreinput devices such as keyboards, computer mice, other pointing devices,touchscreens, etc.

The controller 140 in accordance with embodiments of the presentinvention may include or consist essentially of a general-purposecomputing device in the form of a computer including a processing unit(or “computer processor”), a system memory, and a system bus thatcouples various system components including the system memory to theprocessing unit. Computers typically include a variety ofcomputer-readable media that can form part of the system memory and beread by the processing unit. By way of example, and not limitation,computer readable media may include computer storage media and/orcommunication media. The system memory may include computer storagemedia in the form of volatile and/or nonvolatile memory such as readonly memory (ROM) and random access memory (RAM). A basic input/outputsystem (BIOS), containing the basic routines that help to transferinformation between elements, such as during start-up, is typicallystored in ROM. RAM typically contains data and/or program modules thatare immediately accessible to and/or presently being operated on byprocessing unit. The data or program modules may include an operatingsystem, application programs, other program modules, and program data.The operating system may be or include a variety of operating systemssuch as Microsoft WINDOWS operating system, the Unix operating system,the Linux operating system, the Xenix operating system, the IBM AIXoperating system, the Hewlett Packard UX operating system, the NovellNETWARE operating system, the Sun Microsystems SOLARIS operating system,the OS/2 operating system, the BeOS operating system, the MACINTOSHoperating system, the APACHE operating system, an OPENSTEP operatingsystem or another operating system of platform.

Any suitable programming language may be used to implement without undueexperimentation the functions described herein. Illustratively, theprogramming language used may include assembly language, Ada, APL,Basic, C, C++, C*, COBOL, dBase, Forth, FORTRAN, Java, Modula-2, Pascal,Prolog, Python, REXX, Matlab, Labview, R, and/or JavaScript for example.Further, it is not necessary that a single type of instruction orprogramming language be utilized in conjunction with the operation ofsystems and techniques of the invention. Rather, any number of differentprogramming languages may be utilized as is necessary or desirable.

The computing environment may also include other removable/nonremovable,volatile/nonvolatile computer storage media. For example, a hard diskdrive may read or write to nonremovable, nonvolatile magnetic media. Amagnetic disk drive may read from or write to a removable, nonvolatilemagnetic disk, and an optical disk drive may read from or write to aremovable, nonvolatile optical disk such as a CD-ROM or other opticalmedia. Other removable/nonremovable, volatile/nonvolatile computerstorage media that can be used in the exemplary operating environmentinclude, but are not limited to, magnetic tape cassettes, flash memorycards, digital versatile disks, digital video tape, solid state RAM,solid state ROM, and the like. The storage media are typically connectedto the system bus through a removable or non-removable memory interface.

The processing unit that executes commands and instructions may be ageneral-purpose computer processor, but may utilize any of a widevariety of other technologies including special-purpose hardware, amicrocomputer, mini-computer, mainframe computer, programmedmicro-processor, micro-controller, peripheral integrated circuitelement, a CSIC (Customer Specific Integrated Circuit), ASIC(Application Specific Integrated Circuit), a logic circuit, a digitalsignal processor, a programmable logic device such as an FPGA (FieldProgrammable Gate Array), PLD (Programmable Logic Device), PLA(Programmable Logic Array), RFID processor, smart chip, or any otherdevice or arrangement of devices that is capable of implementing thesteps of the processes of embodiments of the invention.

As mentioned above, after formation of one line of a desiredtwo-dimensional pattern, the composite material 130 is moved in adirection 170 substantially orthogonal to the width of patterning head120 by material handling system 150 to produce a two-dimensional patternin patternable material 128. The controller 140 energizes differentactuators as the composite material 130 is moved through abrasionstation 110 and patterning head 120 in a direction substantiallyorthogonal to the width of pattern head 120. FIG. 1C shows the system ofFIG. 1B at a later stage in time. A void 160 in patternable material 128is formed when abrasion station 110 removes a portion of the patternablematerial 128. In this example, actuator 121 was de-energized before oras composite material 130 was moved in direction 170, leaving the void160 surrounded by unaltered patternable material 128 in the direction170. If actuator 121 were not de-energized, the structure may resemblethat shown in FIG. 1D, in which void 161 is extended in length indirection 170.

FIG. 1E shows a cross-sectional view of the structure of FIG. 1D throughcut line A-A′ of FIG. 1D. FIG. 1E shows multiple actuators 121 acrossthe width of patterning head 120. In various embodiments, abrasion head111 may include or consist essentially of a single-piece or continuousabrasion head, while in other embodiments abrasion head 111 may includeor consist essentially of multiple abrasion heads (for example, eachcorresponding to the approximate location of one or more of theactuators 121). FIG. 1E shows the patterning system with all actuators121 in the de-energized state. FIG. IF shows the patterning system withsome of the actuators 121 energized. As may be seen, substrate 125 andpatternable material 128 are deformed by actuators 121, such that thepatternable material 128 over energized actuators 121 is brought intocontact with the abrasion head 111, and the patternable material 128 isremoved in these regions, while patternable material 128 overde-energized actuators 121 is not brought into contact with abrasionhead 111, and patternable material 128 is not removed in those regions,as shown in FIG. 1G. FIG. 1G shows an example of composite material 130with portions of patternable material 128 removed, after patterning.

In various embodiments of the present invention, controller 140 mayrepeat the pattern after a certain length of composite material 130 haspassed through abrasion station 110 and patterning head 120, while inother embodiments the pattern may not repeat. In various embodiments,composite material 130 may be in sheet form, while in others compositematerial 130 may be in roll or web form. In various embodiments,composite material 130 may be moved through abrasion station 110 andpatterning head 120 using material handling system 150 that is alsocontrolled by controller 140 and synchronized with pattern head 120, toproduce the desired line pattern along the length of composite material130, as shown in FIG. 1A, and the desired two-dimensional pattern inpatternable material 128 over the area of composite material 130. Invarious embodiments, abrasion head 110 may include or consistessentially of one or more milling or grinding wheels, ultrasonicmilling tools, and/or ablation tools, for example a sand or beadblaster, or the like.

Four key aspects of embodiments of the present invention are (1) thepattern of composite material 130 may be changed very easily by changingthe instructions or recipe for controller 140, (2) there is norestriction on repeat dimensions, as may be the case for processes inwhich repeating pattern units are dictated by a pre-designed wheel,stamp, or roller with a fixed dimension or circumference, (3) theprocess does not use any chemicals for removal of the patternablematerial (although the composite material may be rinsed or otherwisecleaned to remove any dust or particulates before and/or after abrasiveremoval of the patternable material), and (4) the process may beperformed very rapidly.

In various embodiments, the process may be performed in a roll-to-rollconfiguration, for example as shown for patterning system 200 in FIG. 2(the control system is not shown in FIG. 2 for clarity). Patterningsystem 200 is similar to the system of FIG. 1A; however, in FIG. 2material handling system 150 is replaced by a roll-to-roll materialhandling system that includes or consists essentially of a supply reel210 and a take-up reel 220, and web 230 is utilized instead of sheets ofcomposite material 130. In various embodiments, web 230 includes orconsists essentially of composite material 130 in web form (not sheetform).

In various embodiments, substrate 125 may include or consist essentiallyof a semicrystalline or amorphous material, e.g., polyethylenenaphthalate (PEN), polyethylene terephthalate (PET), polycarbonate,polyethersulfone, polyester, polyimide, polyethylene, fiberglass, FR4,glass, metal core printed circuit board, (MCPCB), and/or paper. Invarious embodiments of the present invention, substrate 125 may includemultiple layers. Depending upon the desired application for whichembodiments of the invention are utilized, substrate 125 may besubstantially transparent, translucent, or opaque. For example,substrate 125 may exhibit a transmittance or a reflectivity greater than70% for wavelengths ranging between approximately 400 nm andapproximately 700 nm. In various embodiments, substrate 125 may besubstantially insulating, and may have an electrical resistivity greaterthan approximately 100 ohm-cm, greater than approximately 1×10⁶ ohm-cm,or even greater than approximately 1×10¹⁰ ohm-cm. In variousembodiments, substrate 125 may have a thickness in the range of about 10μm to about 5 mm; however, the thickness of substrate 125 is not alimitation of the present invention. In various embodiments, thesubstrate 125 is “flexible” in the sense of being pliant in response toa force such that the substrate may be easily bent or otherwise deformedwithout damage thereto. The substrate 125 may also be resilient, i.e.,tending to elastically resume an original configuration upon removal ofthe force. In some embodiments, a flexible substrate 125 is configurableto a radius of curvature of about 1 m or less, or about 0.5 m or less,or even about 0.1 m or less. In some embodiments, flexible substrate 125has a Young's Modulus less than about 100 N/m², less than about 50 N/m²,or even less than about 10 N/m². In some embodiments, a flexiblesubstrate 125 has a Shore A hardness value less than about 100; a ShoreD hardness less than about 100; and/or a Rockwell hardness less thanabout 150.

Patternable material 128 may be formed on substrate 125 by a variety ofmeans, for example including physical deposition, vapor phasedeposition, chemical vapor phase deposition, plating, lamination,evaporation, sputtering, doctor blade formation, or the like. The methodof forming patternable material 128 on substrate 125 is not a limitationof the present invention. In various embodiments, patternable material128 may have a thickness in the range of about 1 μm to about 5 mm;however, the thickness of patternable material 128 is not a limitationof the present invention. In various embodiments, patternable material128 may include or consist essentially of a conductive material (e.g.,an ink or a metal, metal film or other conductive materials or thelike), which may include one or more elements such as silver, gold,aluminum, chromium, copper, and/or carbon. In various embodiments,conductive patternable material 128 may have a thickness in the range ofabout 50 nm to about 1000 μm.

In various embodiments, substrate 125 may include or consist essentiallyof one more materials such as metal, paper, plastic, fabric, leather,ceramic, or the like. In various embodiments, patternable material 128may include or consist essentially of one or more materials such asmetal, paper, plastic, fabric, leather, ceramic, or the like. Ingeneral, patternable material 128 is composed of one or more materialshaving mechanical properties and/or thicknesses enabling the material tobe removed by abrasion head 111 (e.g., by abrasion, ultrasound milling,etc.).

While examples of composite material 130 have been described as havingtwo layers, a substrate and a patternable material, this is not alimitation of the present invention, and in other embodiments compositematerial 130 may include, consist essentially of, or consist of onelayer or more than two layers.

In various embodiments, all or a portion of patternable material 128 maybe covered or encapsulated. In some embodiments, a layer of material,for example an insulating material, may be disposed over all or aportion of patternable material 128. Such a material may include, e.g.,a sheet of material such as used for substrate 125, a printed layer, forexample using screen, ink jet, stencil or other printing means, alaminated layer, or the like. Such a printed layer may include, forexample, an ink, a plastic and oxide, or the like. The covering materialand/or the method by which it is applied are not limitations of thepresent invention.

In various embodiments, composite material 130, substrate 125 and/orpatternable material 128 may have a Young's Modulus less than about50×10⁹ N/m², less than about 10×10⁹ N/m², or even less than about 5×10⁹N/m². In some embodiments, composite material 130, substrate 125 and/orpatternable material 128 may have a Shore A hardness value less thanabout 100; a Shore D hardness less than about 100; and/or a Rockwellhardness less than about 150.

In various embodiments of the present invention, the pattern resolutionachievable in patternable material 128 may be related to the thicknessof patternable material 128, the deformability or pliability ofcomposite substrate 130, and/or the size of actuators 121 and abrasionhead 111. FIG. 3 shows a schematic top view of some of the actuators 121of patterning head 120. In the example shown in FIG. 3, actuators 121have a square cross-section; however, this is not a limitation of thepresent invention, and in other embodiments actuators 121 may havedifferent cross-sectional shapes, for example circular, triangular,hexagonal, or the like. In various embodiments, actuators 121 may have asize in the range of about 10 μm to about 1 mm; however, the actual sizeof an actuator 121 is not a limitation of the present invention. FIG. 3shows a schematic of square actuators 121, having dimensions 310 and330, which for a square actuator are equal; however, in otherembodiments, dimensions 310 and 330 may be different from each other.FIG. 3 shows a schematic of actuators 121 spaced apart from each otherby a gap 320. In various embodiments, gap 320 may be in the range ofabout 10 μm to about 1 mm; however, in other embodiments, gap 320 may bedifferent. In various embodiments, actuators 121 may have a range ofmotion (i.e., extent of vertical travel toward the material to bepatterned) of at least about 0.25 mm or of at least about 0.5 mm or ofat least about 1 mm; however, the range of motion of actuators 121 isnot a limitation of the present invention. In other embodiments,actuators 121 may have a range of motion (i.e., extent of verticaltravel toward the material to be patterned) of at least about 10 μm orof at least about 50 μm or of at least about 100 μm.

In various embodiments, the speed or throughput of the patterningprocess is related to the speed with which patternable material 128 maybe removed from substrate 125 as well as the actuator speed. In variousembodiments, the actuators may resemble a dot matrix print head, whereeach dot in the dot matrix print head corresponds to an actuator 121. Invarious embodiments, composite material 130 may be processed by thepatterning system at a rate of at least 5 meters/min or at least 10meters/min or at least 25 meters/min or at least 50 meters/min.

In various embodiments, the patterning system may include one or moremeans to improve resolution by increasing the conformability ofcomposite material 130 over actuator 121. For example, in variousembodiments, composite material 130 may be heated before entering and/orwithin the patterning region (region of patterning head 120 and abrasionstation 110), for example to soften composite material 130 and permit arelatively improved conformability of composite material 130 overactuators 121. In various embodiments of the present invention, pressuremay be applied over or tension may be applied to composite material 130in the region of actuators 121, to aid in conforming composite material130 to actuator pin 121. In various embodiments of the presentinvention, pressure may be applied mechanically, for example by a workpiece on one or both sides of actuator pin 121 (in direction 170). Invarious embodiments of the present invention, pressure may be applied inthe form of gas pressure, for example air pressure, applied to the topsurface of composite material 130 in the region of actuator pin 121(e.g., on the side of composite material 130 opposite actuator pin 121).In various embodiments, the work piece or the gas may be heated.

In various embodiments, patterning systems of the present invention,such as patterning system 100 or 200, may be incorporated into othermanufacturing systems, for example roll-to-roll manufacturing systems.FIG. 4 shows a system 400 for making flexible circuits in a roll-to-rollprocess in accordance with various embodiments of the present invention.In various embodiments, system 400 includes a supply reel 210 providingcomposite material 230 to a patterning station 450 (as described herein)to form a pattern of conductive traces on an insulating substrate (forexample, aluminum on PET), an adhesive dispense station 410 to formconductive adhesive in the appropriate regions of web 230, a placementstation 420 to place bare-die or packaged chips (e.g., light-emittingdiodes) on web 230, a cure station 430 to cure the conductive adhesive,forming an electrical connection between the bare or packaged devicesand the conductive traces on the insulating substrate, and a teststation 440 to perform an in-line test of the finished circuit. WhileFIG. 4 shows stations 410 to 450 in the order described herein, this isnot a limitation of the present invention, and in other embodimentssystems and processes of the present invention may include fewer or moresteps or stations and/or the steps or stations may be performed orpositioned in different order. In various embodiments, system 400 may beutilized for the manufacture of radio frequency identification (RFID)components and/or light-emitting sheets (or “light sheets”), for exampleas described in U.S. patent application Ser. No. 13/799,807, filed onMar. 13, 2013, U.S. patent application Ser. No. 13/970,027, filed onAug. 19, 2013, U.S. Provisional Patent Application No. 61/985,759, filedon Apr. 29, 2014, and U.S. Provisional Patent Application No.62/029,151, filed on Jul. 25, 2014, the entire disclosure of each ofwhich is incorporated by reference herein.

In various embodiments, the adhesive may be an anisotropic conductiveadhesive (ACA) as described in U.S. patent application Ser. No.13/171,973, filed on Jun. 29, 2011, the entirety of which isincorporated by reference herein. In various embodiments, adhesivedispense station 410 may include or consist essentially of a reservoirfor adhesive and a pressure dispense system, a jetting system, or thelike; however, the means of dispensing adhesive is not a limitation ofthe present invention. In various embodiments, placement station 420 mayinclude or consist essentially of a die placement tool, a flip-chip dieplacement tool, a surface mount device pick-and-place tool, or the like;however, the means of placing dies or packaged devices is not alimitation of the present invention. In various embodiments, curestation 430 may include or consist essentially of an applicator of atleast one of pressure, heat, magnetic field, UV radiation, or the like(e.g., an oven, a hot plate, a UV lamp, a pressure cell, and/or one ormore magnets or electromagnets); however, the means of curing theadhesive is not a limitation of the present invention. In variousembodiments, the adhesive is cured using a thermode system (i.e., systemin which heat and pressure are applied simultaneously by one or moreheating elements). In various embodiments, test station 440 may includeor consist essentially of, for example, a wafer prober including one ormore electronic probes (e.g., one or more probe cards), a power supply,and one or more current meters and/or voltage meters.

In various embodiments, conductive traces are formed with a gap betweenadjacent conductive traces, and components (for example, resistors,transistors, diodes, light-emitting diodes (LEDs), integrated circuits,and the like) are electrically coupled to the conductive traces usingconductive adhesive, e.g., an isotropically conductive adhesive and/oran ACA. ACAs may be utilized with or without stud bumps and embodimentsof the present invention are not limited by the particular mode ofoperation of the ACA. For example, the ACA may utilize a magnetic fieldrather than pressure (e.g., the ZTACH ACA available from SunRayScientific of Mt. Laurel, N.J., for which a magnetic field is appliedduring curing in order to align magnetic conductive particles to formelectrically conductive “columns” in the desired conduction direction).Furthermore, various embodiments utilize one or more other electricallyconductive adhesives, e.g., isotropically conductive adhesives,non-conductive adhesives, in addition to or instead of one or more ACAs.In other embodiments, components may be attached to and/or electricallycoupled to conductive traces by other means, for example solder, reflowsolder, wave solder, wire bonding, or the like. The means by which thecomponents are attached to the conductive traces is not a limitation ofthe present invention.

In various embodiments, systems like that shown in FIG. 4 may beutilized to manufacture flexible light sheets, where the flexible lightsheet includes a substrate, conductive traces formed over the substrateand an array of light-emitting elements (LEEs) electricallyinterconnected by the conductive traces. FIG. 5 shows a schematic of anexemplary embodiment of a light sheet 500, which includes substrate 125,power conductors 510 and 520, and conductive elements 560, all formed ofpatternable material 128, for example as describe in U.S. patentapplication Ser. No. 13/799,807, filed on Mar. 13, 2013, U.S. patentapplication Ser. No. 13/970,027, filed on Aug. 19, 2013, and U.S. patentapplication Ser. No. 14/699,149, filed on Apr. 29, 2015, the entiredisclosure of each of which is incorporated by reference herein. Invarious embodiments, substrate 125 includes, consists essentially of, orconsists of PET, PEN, polyimide, glass, plastic, and/or paper, andsubstrate 125 may have a thickness in the range of about 5 μm to about500 μm, or in the range of about 9 μm to about 125 μm. In variousembodiments, patternable material 128 may include or consist essentiallyof copper, aluminum, carbon, gold, silver, silver ink, and/or conductiveink, and patternable material 128 may have a thickness in the range ofabout 50 nm to about 200 μm, or in the range of about 1 μm to about 100μm. LEEs 540 may be electrically coupled to conductive elements 560, forexample using adhesive, conductive adhesive, ACA, solder or the like, asdescribed herein.

In various embodiments, multiple LEEs 540 may be interconnected withconductive elements 560 to form one or more strings 550. For example,LEEs 540 in a string 550 may be serially connected, and one end ofstring 550 may be electrically connected to power conductor 510 whilethe other end is electrically connected to power conductor 520. Invarious embodiments, LEEs 540 may be disposed in a regular periodicarray, for example having a pitch (or “spacing”) 505; however, this isnot a limitation of the present invention, and in other embodiments LEEs540 may be positioned in other patterns or randomly. In variousembodiments, one or more additional elements may be electrically coupledto conductive traces 560 and/or power conductors 510, for exampleresistors, capacitors, inductors, transformers, diodes, integratedcircuits, and the like. In various embodiments, light sheet 500 may beseparable, via a cut 530 spanning the power conductors 510, 520 and notcrossing a light-emitting string 550, into two partial light sheets thateach include or consist essentially of (i) one or more light-emittingstrings 550, and (ii) portions of the power conductors 510, 520configured to supply power to and thereby illuminate the one or morelight-emitting strings of the partial light sheet, for example asdescribed in U.S. patent application Ser. No. 13/799,807, filed on Mar.13, 2013, and U.S. patent application Ser. No. 13/970,027, filed on Aug.19, 2013, the entire disclosure of each of which is incorporated byreference herein.

In various embodiments, light sheet 500 may be manufactured using asystem similar to that shown in FIG. 4, starting with an input roll ofcomposite material 130 (or web 230). In various embodiments, substrate125 and patternable material 128 may initially separate and mated toform the composite material 130 in the system of FIG. 4, i.e., as partof the roll-to-roll process (e.g., substrate 125 and patternablematerial 128 may be supplied from different rolls and joined in aninitial stage of the process). Various embodiments of the presentinvention may include multiple patterning stations, for example, morethan one patterning station 450 as described with respect to FIG. 4. Inanother example, system 100 of FIG. 1A may have multiple abrasionstations 110 and corresponding patterning heads 120.

In various embodiments of the present invention, all or portions ofsystems shown in FIG. 1A and/or FIG. 2 (or similar systems) may be usedto recycle or partially recycle light sheets and similar materials ordevices. For example, FIG. 6 shows an exemplary system 600 in accordancewith embodiments of the present invention for recycling light sheets.System 600 includes supply reel 210 on which is mounted a web 230 thatincludes composite material 130 and LEEs 540, a component removalstation 670, and a material removal station 660. In various embodiments,the composite material may be supplied in a roll, as shown in FIG. 6;however, this is not a limitation of the present invention, and in otherembodiments composite material may be supplied in sheets and system 600may be configured to handle individual sheets. In various embodiments,component removal station 670 is configured to remove at least portionsof at least some of the components that are mounted on web 230, forexample active devices, passive devices, switches, connectors, etc. Invarious embodiments of the present invention, component removal station670 may include or consist essentially of a scraper 620 that may beconfigured to scrape off (e.g., mechanically remove) LEEs 540 and anyother components, connectors, switches or the like mounted on compositematerial 130. Removed components, identified as 540′, may be collectedin a bin 610. After optional removal of components 540, material removalstation 660 may be utilized to remove one or more layers from webmaterial 230. In various embodiments of the present invention,patternable material 128 may be removed by abrasion head 111 at abrasionstation 110.

In various embodiments, a positioner 611 may be utilized to urgecomposite material 130 to the proper height such that substantially allof patternable material 128 is removed from substrate 125 via mechanicalinteraction with the abrasion head 111. Removed patternable material,identified as 630 in FIG. 6, may be collected in a bin 640. In variousembodiments in which patternable material 128 includes, consistsessentially of, or consists of a metal such as aluminum or copper,removed patternable material 630 may be relatively easily recycled, asit may be relatively pure metal. In various embodiments of the presentinvention, there is no need for chemical removal and chemical separationof patternable material 630 from an etchant or other solution as is thecase in conventional recycling systems.

While FIG. 6 shows stations 670 and 660 in the order described herein,this is not a limitation of the present invention and in otherembodiments systems and processes of the present invention may includefewer or more steps or stations and/or the steps or stations may beperformed or positioned in different order.

In various embodiments, the relative height of scraper 620 and abrasionhead 111 may be adjusted to ensure complete removal of patternablematerial 128 or no removal of patternable material 128 or a balance inbetween, depending on the needs of the recycling system. In variousembodiments, web 230 is supported under and/or urged toward abrasionhead 111 (for example by positioner 611) and optionally supported underand/or urged toward scraper 620 (not shown in FIG. 6).

In various embodiments, the abrasion depth is controlled by a feedbacksystem, for example using optical or electrical means to control theabrasion depth. In various embodiments in which patternable material 128is electrically conductive, a circuit may be formed between abrasionhead 111 and patternable material 128. When abrasion head 111 removesall patternable material 128 and contacts non-electrically conductivesubstrate 125, the circuit is broken, and this feedback may be used toraise and lower abrasion head 111 to the proper abrasion height. Forexample, controller 140 may be utilized to control the variouscomponents of system 600 in response to such feedback. In variousembodiments, alternate feedback signals may be used. For example, invarious embodiments in which substrate 125 is transparent or relativelytransparent and patternable material 128 is not transparent or notrelatively transparent to a wavelength of light, light including thatwavelength of light incident upon the top of composite substrate 125will not be detected from below, but once the patternable material isremoved, the light may be detected and this signal may be used as afeedback signal to properly position abrasion head 111 to ensure optimalabrasion of patternable material 128 from substrate 125.

The terms and expressions employed herein are used as terms andexpressions of description and not of limitation, and there is nointention, in the use of such terms and expressions, of excluding anyequivalents of the features shown and described or portions thereof. Inaddition, having described certain embodiments of the invention, it willbe apparent to those of ordinary skill in the art that other embodimentsincorporating the concepts disclosed herein may be used withoutdeparting from the spirit and scope of the invention. Accordingly, thedescribed embodiments are to be considered in all respects as onlyillustrative and not restrictive.

What is claimed is:
 1. A method of recycling a device comprising aplurality of electronic components disposed over a composite material,the composite material comprising a substrate and a patternable materialdisposed thereover, wherein the patternable material is patterned toform a pattern therein, the method comprising: receiving a portion ofthe device; removing one or more electronic components from the receivedportion of the device; urging one or more regions of the receivedportion of the device toward an abrasion head, whereby the abrasion headmechanically removes at least a portion of the patternable material ineach of the one or more regions; and repeating the above steps for oneor more portions of the device.
 2. The method of claim 1, whereinremoving the one or more electronic components from the received portionof the device comprises mechanical scraping.
 3. The method of claim 1,wherein one or more regions of the received portion of the device areurged toward the abrasion head by one or more actuators, the receivedportion of the device being disposed between the abrasion head and theone or more actuators.
 4. The method of claim 1, further comprisingstoring the one or more removed electronic components after removalthereof.
 5. The method of claim 1, further comprising storing theremoved at least a portion of the patternable material after removalthereof.
 6. The method of claim 1, wherein the portion of the device isreceived from a supply reel.
 7. The method of claim 6, furthercomprising, after urging the one or more regions of the received portionof the device toward the abrasion head, transferring the receivedportion of the device to a take-up reel.
 8. The method of claim 1,further comprising, after urging the one or more regions of the receivedportion of the device toward the abrasion head, transferring thereceived portion of the device to a take-up reel.
 9. A method ofrecycling a device comprising a plurality of electronic componentsdisposed over a composite material, the composite material comprising asubstrate and a patternable material disposed thereover, wherein thepatternable material is patterned to form a pattern therein, the methodcomprising: receiving a portion of the device from a supply reel;removing one or more electronic components from the received portion ofthe device; removing at least a portion of the patternable material fromthe received portion of the device; thereafter, transferring thereceived portion of the device to a take-up reel; and repeating theabove steps for one or more portions of the device.
 10. The method ofclaim 9, wherein removing the one or more electronic components from thereceived portion of the device comprises mechanical scraping.
 11. Themethod of claim 9, wherein removing the at least a portion of thepatternable material from the received portion of the device comprisesurging the received portion of the device toward an abrasion head,whereby the abrasion head mechanically removes at least a portion of thepatternable material from the received portion of the device.
 12. Themethod of claim 11, wherein the received portion of the device is urgedtoward the abrasion head by one or more actuators, the received portionof the device being disposed between the abrasion head and the one ormore actuators.
 13. The method of claim 9, further comprising storingthe one or more removed electronic components after removal thereof. 14.The method of claim 9, further comprising storing the removed at least aportion of the patternable material after removal thereof.
 15. A systemfor recycling a device comprising a plurality of electronic componentsdisposed over a composite material, the composite material comprising asubstrate and a patternable material disposed thereover, wherein thepatternable material is patterned to form a pattern therein, the systemcomprising: a component-removal station comprising means for removingelectronic components from the composite material; an abrasion stationcomprising means for removing patternable material from the substrate; apatterning head comprising means for urging portions of the compositematerial toward the abrasion station; and a material handling system fortransferring successive portions of the composite material to thecomponent-removal station, the abrasion station, and the patterninghead.
 16. The system of claim 15, wherein the means for removingpatternable material comprises one or more abrasion heads.
 17. Thesystem of claim 15, wherein the means for removing patternable materialcomprises one or more milling or grinding wheels, one or more ultrasonicmilling tools, and/or one or more ablation tools.
 18. The system ofclaim 15, wherein the means for urging portions of the compositematerial toward the abrasion station comprises one or more actuators.19. The system of claim 15, wherein the material handling systemcomprises: a supply reel for supplying the composite material tocomponent-removal station, the abrasion station, and the patterninghead; and a take-up reel for receiving the composite material fromcomponent-removal station, the abrasion station, and the patterninghead.
 20. The system of claim 15, wherein the means for removingelectronic components from the composite material comprises a mechanicalscraper.
 21. The system of claim 15, further comprising a receptacle forreceiving removed electronic components.
 22. The system of claim 15,further comprising a receptacle for receiving removed patternablematerial.